Nintendo Switch 2 alleged motherboard leaks, patent confirms DLSS upscaling-like tech

Highly anticipated: The buzz surrounding Nintendo’s upcoming handheld has been growing, with leaks intensifying in recent weeks. Speculation about the performance and features of the Switch 2 has been reignited, as new material hints at an imminent official unveiling. While leaks provide some insights, it’s important to take information not directly from Nintendo with caution.

New images of a purported Switch 2 PCB surfaced on Reddit on New Year’s Eve. Around the same time, a document from the US Patent Office revealed Nintendo’s exploration of machine learning-based upscaling, similar to technologies found in Nvidia RTX graphics cards and the rumored PlayStation 5 Pro.

While the leaked motherboard images don’t definitively confirm hardware specs, they align with previous rumors about the upcoming handheld. The patent indicates that Nintendo has been looking into AI-assisted upscaling on the Nvidia chip powering the alleged Switch 2 console.

The document, filed in 2023 and published in late 2024, describes a technique utilizing Nvidia’s tensor cores for upscaling images. Although it doesn’t mention DLSS specifically, which has been a game-changer for PC gaming, it highlights the potential for enhancing image quality.

The proposed functionality would use neural networks to upscale images from lower resolutions to higher ones, potentially reducing a game’s install size. This could be beneficial for titles designed for higher resolutions, helping them conserve storage space on the Switch 2’s game cards.

Nintendo has confirmed limited details about its upcoming hardware, including a release before April 1 and backwards compatibility with Switch games. Leaks from the manufacturing supply chain suggest key features such as 12 GB of LPDDR5X RAM, an 8-inch LCD screen, and magnetic Joy-Con attachments.

The device is expected to utilize a chip based on Nvidia’s Ampere architecture, but specific performance metrics remain unknown. Recent mockups of the Switch 2’s design are said to closely resemble the final product, adding to the anticipation surrounding the handheld’s release.

The leaked PCB photos raise questions about the chip’s manufacturing process, with possibilities ranging from Samsung’s 8nm node to a more advanced 6nm or 5nm SoC. These advancements could offer improved performance and battery life for the upcoming Nintendo handheld.